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Uncooled Near-Infrared Linear Image Sensor with 512X1 Pixels

Product Description: 

Precision Micro-Optics offers cooled near-infrared linear image sensor consisting of a linear InGaAs-detector array bonded to the p-on-n readout IC.

 

 

Product Features:

  • 512X1 Pixels (25X250um or 25X500um)
  • 28-pin Ceramic DIP (CDIP)
  • Built-in Temperature Sensor
  • 0.9 μm – 1.7 μm Spectral Range
  • Minimum Pixel Operability > 99%
  • Quantum Efficiency > 70%
  • Snapshot ITR / IWR
  • 2 Outputs with up to 22 MHz Pixel Rate

Applications:

  • Shortwave-Infrared Imaging
  • Semiconductor Inspection / Process Monitoring
  • Near-Infrared Spectrophotometr

SPECIFICATIONS (ITS = 20 ± 1ºC)(Readings from Integrated Temperature Sensor (ITS)):

Parameters
Symbol
Test conditions
Min
Typ Max
Unit
Sensor Technology
    Planar InGaAs PIN

Actual Pixel Array
    512 x 1

Pixel Pitch
    25
um
Pixel Size (S)
    25 X25
um
Pixel Size (M)
    25 X250
um
Pixel Size (L)
    25 X500
um
Spectral Response Range
λ
  900
  1700
nm
Dark Current (S)(*)
ID
VR = 0.5V
 
0.4
nA
Dark Current (M)(*)
ID
VR = 0.5V
 
0.6
nA
Dark Current (L)(*)
ID
VR = 0.5V
 
1
nA
Quantum Efficiency * Fill Factor(*)
QEFF
λ = 1550nm
70

%
Response Nonuniformity(*)

At 50 % Full Well

5
%
Response Nonlinearity

15 % – 85 % Well Occupation Range

2
%
Charge Capacity
(16 settings)


Cint = 6.4 fF

25
  μV/e-
Cint = 16 fF

10
 
Cint = 30 fF

5.3
 
Cint = 120 fF

1.3
 
Cint = 2.1 pF

0.076
 
Readout Noise
(ROIC Specifications )


Cint = 6.4 fF

1.2
  mV
Cint = 16 fF

0.8
 
Cint = 30 fF

0.6
 
Cint = 120 fF

0.5
 
Cint = 2.1 pF

0.25
 
Output Swing

Gain @ 120 fF
2.0

V
Minimum Integration Period

 ROIC Specifications  5

μs
Maximum Pixel Rate

 ROIC Specifications  
22
MHz
Pixel Operability(*)
VBD
Percentage of Pixels with QEFF
Deviation ± 20%*(QEFF Mean)
99
  %
Chip Size
    15.3 x 4.5
mm
Package Type
    28-pin Ceramic DIP (CDIP)

Package Size L x W x T
    35.56 x 15.61 x 7.15
mm
Weight
    5.18
g

Note (*): These items are defined for central effective pixel array (512x1). Their values correspond to default operation conditions.

 

Absolute Maximum Ratings (T=25ºC):

  Parameters
Min
Typ Max
Unit
  Operating Temperature
-40
  70
°C
  Storage Temperature
-40
  70
°C
  Power Consumption
    95
mW

 

Package Dimensions (mm) and Pin Definition:

  01
VDD
08
SDOUT 15
GND
22
NC
  02
RESET
09
DATVALID 16
NC
23
NC
  03
NC
10
VOUT 17
NC
24
NC
  04
INT
11
VDDA 18
VTEMP
25
NC
  05
MC
12
VR2 19
NC
26
NC
  06
CEB
13
VR1 20
NC
27
NC
  07
SDIN
14
VDETCOM 21
NC
28
NC

CHIP LAYOUT:

 

SPI Interface:

The Linear Image Sensor supports SPI protocol to set the command registers. There are functions of the gain mode, power consumption control and the sequence of pixel output.

 

Bias Input :

  Pin #
Bias
Voltage Current
Remark
  01
VDD
1.8 V > 30 mA
Positive logic supply
  11
VDDA
3.6 V > 60 mA
Positive analog supply
  12
VR2
0.3 V > 30 mA
External Input Bias
  13
VR1
2.3 V > 5 mA
External Input Bias
  14
VDETCOM
> VR1
Detector common voltage
Detector bias = VDETCOM - VR1 (*)
  15
GND
0V
Ground
  02
RESET
1.8 V
Chip reset

Note (*): VDETCOM lower than 2.3 V will forward bias the sensor, the exact zero bias voltage is device and temperature dependent.

Digital Pattern Input :

  Pin #
Clocks
Levels Rise/Fall
Remark
  04
INT
1.8 V / 0 V < 50 nS
Integration time
  05
MC
1.8 V / 0 V < 5 nS
Master clock, Max. Freq. = 22 MHz
  06, 23
CEB
1.8 V / 0 V < 10 nS
Chip enable(*)
  07
SDIN
1.8 V / 0 V < 5 nS
Data code input

Note (*): The input and output of all commands start after the falling edge of CEB.

Digital Pattern Output :

  Pin #
Clocks
Levels Rise/Fall
Remark
  08
SDOUT
1.8 V / 0 V
Data code output
  09
DATVALID
1.8 V / 0 V
Valid data output flag signal

Analog Output :

  Pin #
Outputs
Levels Value
Remark
  10
VOUT
0.2 ~ 2.4 V
Video output
  18
VTEMP
2.138 V 27℃
Integrated Temperature Sensor (-0.6 mV /℃)

Figures :

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